Resin forming body and production method thereof

This invention relates to a resin forming body and the production method thereof. When the resin is molded, inorganic fillers are mixed in the thermoplastic resin previously. Although the exothermic property of the inorganic fillers is excellent, the hardness of which is higher than that of the ther...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUMI, YASUO, HARADA, HIROSHI, MAEDA, MITSUO, KOMATSU, SHINTARO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRICITY INSULATORS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	This invention relates to a resin forming body and the production method thereof. When the resin is molded, inorganic fillers are mixed in the thermoplastic resin previously. Although the exothermic property of the inorganic fillers is excellent, the hardness of which is higher than that of the thermoplastic resin and thus tends to abrade peripheral components. The inventors of this invention discovers that if a mould is at a high temperature, the aligning directions of the inorganic fillers composed of fiber shaped exothermic material will become irregular, and through the inorganic fillers contact inside the mould, the cooling efficiency can be elevated. In the method of this invention, adequate thermal conductivity can be obtained even if the resin does not contain such a large amount of the exothermic material that will abrade the peripheral components.