Shield film, shield circuit board having the same and grounding method of shield film

Shield film, shield circuit board having the same and grounding method of shield film

A shield film can easily grounding which a grounding conductor of a substrate as an adhesive object of the shield film is not exposure, a shield circuit board can using the shield film to have shielding function and impedance control function by one step, and a grounding method using the shield film...

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Hauptverfasser: TAKEBE, MINORU, MORIMOTO, SYOHEI
Format: Patent
Sprache:chi ; eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator TAKEBE, MINORU
MORIMOTO, SYOHEI
description A shield film can easily grounding which a grounding conductor of a substrate as an adhesive object of the shield film is not exposure, a shield circuit board can using the shield film to have shielding function and impedance control function by one step, and a grounding method using the shield film are provided. A shield film (20) connected to a conducting part (30) by heating and pressing is formed by a resin having a melting point higher than a temperature of the heating, the shield film (20) includes: a cover film (25) having a layer thickness (L1) thinner than an average protruding length (L2) of conductive particles (35) protruded form a conductive adhesive layer (33) when connecting, and a metal thin film layer (24) and an adhesive layer (23) laminated on the cover film (25) sequentially.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Shield film, shield circuit board having the same and grounding method of shield film
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