Shield film, shield circuit board having the same and grounding method of shield film

A shield film can easily grounding which a grounding conductor of a substrate as an adhesive object of the shield film is not exposure, a shield circuit board can using the shield film to have shielding function and impedance control function by one step, and a grounding method using the shield film are provided. A shield film (20) connected to a conducting part (30) by heating and pressing is formed by a resin having a melting point higher than a temperature of the heating, the shield film (20) includes: a cover film (25) having a layer thickness (L1) thinner than an average protruding length (L2) of conductive particles (35) protruded form a conductive adhesive layer (33) when connecting, and a metal thin film layer (24) and an adhesive layer (23) laminated on the cover film (25) sequentially.