Photocurable resin and photocurable resin composition

Disclosed is a photocurable resin (A) which has a molecular structure represented by general formula (I). Also disclosed is a carboxyl group-containing photocurable resin (A') which is produced by reacting the photocurable resin (A) with an acid anhydride (d). Further disclosed is a photocurabl...

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Bibliographische Detailangaben
Hauptverfasser:	MURATA, YOSHIAKI, ARIMA, MASAO, OKAMOTO, DAICHI, ITO, NOBUHITO, CHUJO, TAKAYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CINEMATOGRAPHY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTROGRAPHY FILLING PASTES HOLOGRAPHY INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	Disclosed is a photocurable resin (A) which has a molecular structure represented by general formula (I). Also disclosed is a carboxyl group-containing photocurable resin (A') which is produced by reacting the photocurable resin (A) with an acid anhydride (d). Further disclosed is a photocurable resin composition which comprises the photocurable resin (A) and/or the carboxyl group-containing photocurable resin (A') and a photopolymerization initiator (B) as the essential components. (In the formula, Ac represents a (meth)acryloyloxy group; R1 represents a residue of an epoxy compound (a), which contains an ethylene group produced by the ring opening of an epoxy group in the compound (a); R2 represents a joint part containing a carbonyloxy group or an urethane bond; n represents an integer of 1 to 99; and m represents 0 or 1.)