Solder resist composition, dry film using same, and printed wiring board

Disclosed is a solder resist composition which has achieved excellent developability and through hole developability, while maintaining solder heat resistance, electroless gold plating resistance and electrical characteristics which are equivalent to or higher than those of conventional solder resis...

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Bibliographische Detailangaben
Hauptverfasser:	ARIMA, MASAO, OKAMOTO, DAICHI, ITO, NOBUHITO, CHUJO, TAKAYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Disclosed is a solder resist composition which has achieved excellent developability and through hole developability, while maintaining solder heat resistance, electroless gold plating resistance and electrical characteristics which are equivalent to or higher than those of conventional solder resists. Also disclosed are a dry film or cured product of the solder resist composition, and a printed wiring board having a cured coating film of the solder resist composition. One embodiment of the solder resist composition contains a photosensitive resin that contains a structure represented by general formula HIP and has at least one ethylenically unsaturated group in each molecule, a photopolymerization initiator, and a carboxyl group-containing resin. Another embodiment of the solder resist composition contains a carboxyl group-containing photosensitive resin that contains a structure represented by general formula HIP and has at least one ethylenically unsaturated group in each molecule, and a photopolymerizatio