Lead-free solder flux composition and lead-free solder composition

Provided is a lead-free solder flux composition containing a component originated from rosins which contains (meth) acrylic acid-modified rosin, dehydroabietic acid and dihydroabietic acid, wherein with respect to the total amount of the component originated from rosins, the content of the dehydroab...

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Bibliographische Detailangaben
Hauptverfasser:	KITAURA, TOMONORI, IWAMURA, EIJI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACYCLIC OR CARBOCYCLIC COMPOUNDS ADHESIVES CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DRIERS (SICCATIVES) DRYING-OILS DYES FRENCH POLISH MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SOLDERING OR UNSOLDERING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING TURPENTINE WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a lead-free solder flux composition containing a component originated from rosins which contains (meth) acrylic acid-modified rosin, dehydroabietic acid and dihydroabietic acid, wherein with respect to the total amount of the component originated from rosins, the content of the dehydroabietic acid is 7 to 65% by weight, and the content of the dihydroabietic acid is 3 to 57% by weight. Also provided is a lead-free solder composition containing this flux composition and a lead-free solder alloy.