Transparent encapsulating composition and optical semiconductor device

Disclosed is a transparent sealing material composition containing: (A) an alkoxysilane-denatured polysiloxane obtained by causing (1) polysiloxane having a silanol group at both ends and represented by general formula (I) (in the formula, R1 represents a methyl group or a phenyl group, the average...

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Bibliographische Detailangaben
Hauptverfasser:	GODA, HIDEKI, IZUMOTO, KAZUHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Disclosed is a transparent sealing material composition containing: (A) an alkoxysilane-denatured polysiloxane obtained by causing (1) polysiloxane having a silanol group at both ends and represented by general formula (I) (in the formula, R1 represents a methyl group or a phenyl group, the average number (m) of repeating units represents 5-500, and the R1 can be the same or different), and (2) tetra-alkoxysilane partial condensate with an average number (n) of Si of 3-6, to undergo a dealcoholization reaction; and (B) a curing catalyst. Further disclosed is an optical semiconductor element obtained using said sealing material composition.