Phenol resin mixture, epoxy resin mixture, epoxy resin composition and cured product

This presentation relates to a phenol resin mixture obtained by reacting a reaction product with phenol to perform a methylene crosslink reaction, wherein the above reaction product comprises by-products obtained through the halomethylation reaction of biphenyl; an epoxy resin mixture obtained by ep...

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Bibliographische Detailangaben
Hauptverfasser:	OSHIMI, KATSUHIKO, SHIRAI, KAZUTERU, SUNAGA, TAKAO, TANAKA, EIICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	This presentation relates to a phenol resin mixture obtained by reacting a reaction product with phenol to perform a methylene crosslink reaction, wherein the above reaction product comprises by-products obtained through the halomethylation reaction of biphenyl; an epoxy resin mixture obtained by epoxidation of the above phenol resin mixture; and an epoxy resin composition containing the above epoxy resin mixture. The epoxy resin mixture or the cured product of the above epoxy resin composition containing the above epoxy resin mixture is not only with excellent flame retardancy but also with a low elastic modulus during storage in a certain range at 250 DEG C compared to cured product of the other flame retardant epoxy resin known in the prior art. The epoxy resin mixture or the epoxy resin composition containing the epoxy resin mixture according to the invention, are useful as semiconductor sealing materials with requirements for high flame retardancy and excellent durability of lead-free soldering.