Robot blade
A robot blade is provided. The robot blade has a plate for containing a wafer and a plurality of bumps disposed on the plate align to an edge of the wafer. Each bump has a surface to directly contact the backside of the wafer, wherein the surface has a roughness from about 20 micro inches to about 5...
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creator | LIN, JINAU LIAO, WEIN CHANG, YONG-SIN LIANG, HSIN-SEHNG LI, CHAO-KENG ZHANG, WEI LAI, MING-JHY |
description | A robot blade is provided. The robot blade has a plate for containing a wafer and a plurality of bumps disposed on the plate align to an edge of the wafer. Each bump has a surface to directly contact the backside of the wafer, wherein the surface has a roughness from about 20 micro inches to about 50 micro inches. |
format | Patent |
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The robot blade has a plate for containing a wafer and a plurality of bumps disposed on the plate align to an edge of the wafer. Each bump has a surface to directly contact the backside of the wafer, wherein the surface has a roughness from about 20 micro inches to about 50 micro inches.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHAMBERS PROVIDED WITH MANIPULATION DEVICES ; CONVEYING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HAND TOOLS ; HANDLING THIN OR FILAMENTARY MATERIAL ; MANIPULATORS ; PACKING ; PERFORMING OPERATIONS ; PNEUMATIC TUBE CONVEYORS ; PORTABLE POWER-DRIVEN TOOLS ; SEMICONDUCTOR DEVICES ; SHOP CONVEYOR SYSTEMS ; STORING ; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING ; TRANSPORTING</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100701&DB=EPODOC&CC=TW&NR=201024054A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20100701&DB=EPODOC&CC=TW&NR=201024054A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN, JINAU</creatorcontrib><creatorcontrib>LIAO, WEIN</creatorcontrib><creatorcontrib>CHANG, YONG-SIN</creatorcontrib><creatorcontrib>LIANG, HSIN-SEHNG</creatorcontrib><creatorcontrib>LI, CHAO-KENG</creatorcontrib><creatorcontrib>ZHANG, WEI</creatorcontrib><creatorcontrib>LAI, MING-JHY</creatorcontrib><title>Robot blade</title><description>A robot blade is provided. 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The robot blade has a plate for containing a wafer and a plurality of bumps disposed on the plate align to an edge of the wafer. Each bump has a surface to directly contact the backside of the wafer, wherein the surface has a roughness from about 20 micro inches to about 50 micro inches.</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
recordid | cdi_epo_espacenet_TW201024054A |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS CHAMBERS PROVIDED WITH MANIPULATION DEVICES CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS HANDLING THIN OR FILAMENTARY MATERIAL MANIPULATORS PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING |
title | Robot blade |
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