Robot blade

A robot blade is provided. The robot blade has a plate for containing a wafer and a plurality of bumps disposed on the plate align to an edge of the wafer. Each bump has a surface to directly contact the backside of the wafer, wherein the surface has a roughness from about 20 micro inches to about 5...

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Hauptverfasser: LIN, JINAU, LIAO, WEIN, CHANG, YONG-SIN, LIANG, HSIN-SEHNG, LI, CHAO-KENG, ZHANG, WEI, LAI, MING-JHY
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creator LIN, JINAU
LIAO, WEIN
CHANG, YONG-SIN
LIANG, HSIN-SEHNG
LI, CHAO-KENG
ZHANG, WEI
LAI, MING-JHY
description A robot blade is provided. The robot blade has a plate for containing a wafer and a plurality of bumps disposed on the plate align to an edge of the wafer. Each bump has a surface to directly contact the backside of the wafer, wherein the surface has a roughness from about 20 micro inches to about 50 micro inches.
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language chi ; eng
recordid cdi_epo_espacenet_TW201024054A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CHAMBERS PROVIDED WITH MANIPULATION DEVICES
CONVEYING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HAND TOOLS
HANDLING THIN OR FILAMENTARY MATERIAL
MANIPULATORS
PACKING
PERFORMING OPERATIONS
PNEUMATIC TUBE CONVEYORS
PORTABLE POWER-DRIVEN TOOLS
SEMICONDUCTOR DEVICES
SHOP CONVEYOR SYSTEMS
STORING
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING
TRANSPORTING
title Robot blade
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