Robot blade

A robot blade is provided. The robot blade has a plate for containing a wafer and a plurality of bumps disposed on the plate align to an edge of the wafer. Each bump has a surface to directly contact the backside of the wafer, wherein the surface has a roughness from about 20 micro inches to about 5...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LIN, JINAU, LIAO, WEIN, CHANG, YONG-SIN, LIANG, HSIN-SEHNG, LI, CHAO-KENG, ZHANG, WEI, LAI, MING-JHY
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHAMBERS PROVIDED WITH MANIPULATION DEVICES CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS HANDLING THIN OR FILAMENTARY MATERIAL MANIPULATORS PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	A robot blade is provided. The robot blade has a plate for containing a wafer and a plurality of bumps disposed on the plate align to an edge of the wafer. Each bump has a surface to directly contact the backside of the wafer, wherein the surface has a roughness from about 20 micro inches to about 50 micro inches.