Method for fabricating a coreless substrate, method for forming a thin circuit board and core for fabricating a coreless substrate

A method for forming a coreless substrate is disclosed. A carrying substrate is provided and a heat resistant film is disposed on the carrying substrate. A lamination process is performed to laminate an insulating layer on the carrying substrate and the heat resistant thin film, wherein the heat res...

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Bibliographische Detailangaben
Hauptverfasser:	HSU, CHIA-WEI, HUANG, CHENG-HUNG, LIN, HSIENIEH, CHIANG, KUOUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A method for forming a coreless substrate is disclosed. A carrying substrate is provided and a heat resistant film is disposed on the carrying substrate. A lamination process is performed to laminate an insulating layer on the carrying substrate and the heat resistant thin film, wherein the heat resistant thin film adhere does not adhere to the insulating layer and the insulating layer is adhered to the substrate at the region out of the heat resistant film during the lamination process. At least a circuit layer is formed on the insulating layer. A sawing process is performed to saw the connecting point of the edge between the insulating layer and the heat resistant thin film for the carrying substrate to be spaced apart from the structural layer thereon and thereunder.