Manufacturing method of chip type resistor bus with concave-shaped electrode
The invention relates to a manufacturing method of chip-type array resistor with concave-shaped electrode. A substrate is formed of a plurality of conductive via-holes with matrix-like distribution. A resistance layer is positioned between two adjacent conductive via-holes. A first protective layer...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a manufacturing method of chip-type array resistor with concave-shaped electrode. A substrate is formed of a plurality of conductive via-holes with matrix-like distribution. A resistance layer is positioned between two adjacent conductive via-holes. A first protective layer is positioned on the resistance layer. A second protective layer is positioned between two vertically adjacent first protective layers after the resistance cutting was carried out by the resistance layer. A first conductive layer is formed on the surface of each conductive via-hole through thin film sputtering. A plurality of array resistor strips are formed by cutting the substrate. A second conductive layer is formed on the first conductive layer of each array resistor strip by impulse electroplating. Finally, the resistor bus strips are folded to a plurality of array resistors. The invention has good yield, low cost and the produced chip-type array resistor with concave-shaped electrode is more suitable for bein |
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