Copper bonding wire, wire bonding structure and method for processing and bonding a wire

A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the sectional area of the non-spherical block portion is bigger than that of the line portion.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HSU, CHENG-TSUNG, HUNG, CHANG-YING, TONG, HO-MING, YIH, WEII, TSAI, TSUNG-YUEH, CHEN, JIANNG, HUNG, CHIHNG, CHANG, HSIAOUAN, LAI, YI-SHAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the sectional area of the non-spherical block portion is bigger than that of the line portion.