Copper bonding wire, wire bonding structure and method for bonding a wire

A copper bonding wire includes a line portion, a block portion and a middle material. The block portion is physically connected to the line portion, and the sectional area of the block portion is bigger than that of the line portion. The meddle material covers a part of the block portion.

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Bibliographische Detailangaben
Hauptverfasser:	HUNG, CHANG-YING, TONG, HO-MING, YIH, WEII, TSAI, TSUNG-YUEH, CHEN, JIANNG, CHANG, HSIAOUAN, LAI, YI-SHAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A copper bonding wire includes a line portion, a block portion and a middle material. The block portion is physically connected to the line portion, and the sectional area of the block portion is bigger than that of the line portion. The meddle material covers a part of the block portion.