Wire bonding structure, method for bonding a wire and method for manufacturing a semiconductor package

Wire bonding structure, method for bonding a wire and method for manufacturing a semiconductor package

A method for bonding a wire includes the following steps of: mounting a medium material on a pas, wherein the medium material covers the pad; heating a copper bonding wire, the medium material or the interface therebetween to be melted by a heating device, whereby the bonding wire is bonded to the m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUNG, CHANG-YING, TONG, HO-MING, YIH, WEII, TSAI, TSUNG-YUEH, CHEN, JIANNG, CHANG, HSIAOUAN, LAI, YI-SHAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method for bonding a wire includes the following steps of: mounting a medium material on a pas, wherein the medium material covers the pad; heating a copper bonding wire, the medium material or the interface therebetween to be melted by a heating device, whereby the bonding wire is bonded to the medium material.