A fabrication method for flexible electronic circuit with smart thin film circuit

The present invention discloses a fabrication method for flexible electronic circuit with smart thin film circuit. Including a flexible substrate and a smart circuit, the smart circuit is adhered to the flexible substrate. The present invention provides a fabrication platform, and can be applied to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG, FANG-HSING, LEE, I, CHANG, KUO-JUI, CHENG, HUANGUNG, TAI, YA-SHIANG, LIU, HAN-WEN, CHANG, RURY-DAR, LIN, CHIA-FENG, LIAO, TAUAN, WANG, SHUI-JINN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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