A fabrication method for flexible electronic circuit with smart thin film circuit

The present invention discloses a fabrication method for flexible electronic circuit with smart thin film circuit. Including a flexible substrate and a smart circuit, the smart circuit is adhered to the flexible substrate. The present invention provides a fabrication platform, and can be applied to...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WANG, FANG-HSING, LEE, I, CHANG, KUO-JUI, CHENG, HUANGUNG, TAI, YA-SHIANG, LIU, HAN-WEN, CHANG, RURY-DAR, LIN, CHIA-FENG, LIAO, TAUAN, WANG, SHUI-JINN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention discloses a fabrication method for flexible electronic circuit with smart thin film circuit. Including a flexible substrate and a smart circuit, the smart circuit is adhered to the flexible substrate. The present invention provides a fabrication platform, and can be applied to all high performance flexible electronic circuits. Using the standard semiconductor process to fabricate the TFT array/circuit on the quartz or glass under high temperature still have high process yield, and have the same character as the traditional CMOS process. The flexible electronic circuit is fabricated by laser re-crystallized low temperature poly crystal thin film transistors or high performance TFT transistor device/circuit by other method. Combining this method and transfers the circuit to the flexible substrate by laser lift-off or other lift-off method.