Polishing pad

It is provided a polishing pad made of laminate of polishing layer and cushion layer. The micro rubber hardness of the said polishing layer is 75 DEG or more and the thickness is from 0.05mm to 1.5mm. On the surface of the said polishing layer, at least 2 kinds of groove groups are formed. The one o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HANAMOTO, MIYUKI, YAMADA, ATSUO, KOBAYASHI, TSUTOMU, SHIRO, KUNIYASU, HASHISAKA, KAZUHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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