Polishing pad

It is provided a polishing pad made of laminate of polishing layer and cushion layer. The micro rubber hardness of the said polishing layer is 75 DEG or more and the thickness is from 0.05mm to 1.5mm. On the surface of the said polishing layer, at least 2 kinds of groove groups are formed. The one o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HANAMOTO, MIYUKI, YAMADA, ATSUO, KOBAYASHI, TSUTOMU, SHIRO, KUNIYASU, HASHISAKA, KAZUHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	It is provided a polishing pad made of laminate of polishing layer and cushion layer. The micro rubber hardness of the said polishing layer is 75 DEG or more and the thickness is from 0.05mm to 1.5mm. On the surface of the said polishing layer, at least 2 kinds of groove groups are formed. The one of the said 2 kinds of groove groups is first groove group and the other is second groove group. The width of each groove in the first groove group is from 0.5mm to 1.2mm and each pitch between grooves is from 7.5mm to 50mm. The width of each groove in the second groove group is from 1.5mm to 3mm and each pitch between grooves is from 20mm to 50mm. And each groove of the said first groove group and each groove of the said second groove group are open toward to the side terminal face of the said polishing layer.