Method for packaging electronic tag and packaged structure thereof

Method for packaging electronic tag and packaged structure thereof

A method for packaging an electronic tag is disclosed. The method for packaging an electronic tag includes steps of providing a substrate, forming a fist high molecular resin layer on the substrate, forming an electronic tag structure on the fist high molecular resin layer, forming a second high mol...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FU, I-JU, CHIANG, HSUEH-MING, LO, YUNGIH, HONG, TIM, TSAI, PEI-SHEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method for packaging an electronic tag is disclosed. The method for packaging an electronic tag includes steps of providing a substrate, forming a fist high molecular resin layer on the substrate, forming an electronic tag structure on the fist high molecular resin layer, forming a second high molecular resin layer on the electronic tag structure and the fist high molecular resin layer, and impregnating a fiber material in the second high molecular resin layer. The packaged electronic tag can sustain bending and washing, and can be sewed in clean clothes for personnel control of the clean room.