Electronic carrier board

An electronic carrier board for use with a chip mounted thereon includes a carrier board proper and a plurality of bond pads. The bond pads each have a corresponding one of a plurality of carrying surface for mounting the chip thereon and for mounting a corresponding one of a plurality of conductive...

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Hauptverfasser: LIN, CHANG-FU, TSAI, KUOING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:An electronic carrier board for use with a chip mounted thereon includes a carrier board proper and a plurality of bond pads. The bond pads each have a corresponding one of a plurality of carrying surface for mounting the chip thereon and for mounting a corresponding one of a plurality of conductive bump thereon. The corresponding ones of the carrying surfaces of at least two corresponding ones of the bond pads tilt opposite to each other, thereby preventing the conductive bumps mounted on the carrying surfaces from displacing along with the chip, and thereby further preventing the corresponding ones of the conductive bumps on two adjacent ones of the bond pads from joining together.