Method of applying catalytic solution for use in electroless deposition

An improved method of activating a surface to receive electroless metal plating thereon, particularly for use in activating through holes in printed circuit substrates, in which the activating solution comprising a palladium tin colloid in an acidic aqueous matrix is sparged with nitrogen gas to slo...

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Bibliographische Detailangaben
Hauptverfasser:	WATKOWSKI, JAMES, DECESARE, WILLIAM J
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	An improved method of activating a surface to receive electroless metal plating thereon, particularly for use in activating through holes in printed circuit substrates, in which the activating solution comprising a palladium tin colloid in an acidic aqueous matrix is sparged with nitrogen gas to slow the oxidation of stannous tin contained therein. A dynamic flood conveyorized system to perform said activation is described.