Resin composition for lens and cured product thereof

The present invention provides a resin composition for lens. The composition can be shaped to the lens which has heat resistance that can endure the solder reflow, excellent low water absorbability, excellent transparency and low thermal expansibility. The resin composition for resin shaping is characterized in that the resin composition uses the following components as necessary components: (A) polyhedral oligomeric silsesquioxane which comprises more than two aliphatic unsaturated bonds in one molecule; (B) organic-group hydrogen-group methylhydrosiloxane which comprises more than two SiH groups in one molecule; (C) ethylene bond type unsaturated compound which comprises more than two (methyl)acryloyl in one molecule; and (d) solid catalyst. The ratio between the number of aliphatic unsaturated bonds of component (A) and the number of SiH groups of component (B) is 1:0.1-2.0. The mole number of (methyl)acryloyl in 100g of resin component comprising the component (A), component (B) and component (C) is large