A method for LED die attachment using a patterned photoresist layer

A method for LED die attachment using a patterned photoresist layer

A method for LED die attachment using a patterned photoresist layer, which includes forming a photoresist layer on a LED chip and filling with solder paste, may control the location or quantity of solder paste by the pattern or the thickness of the patterned photoresist layer. The method includes fo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHAO, TZU-HAO, CHEN, CHUN-PENG, KUO, HSIN-NAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method for LED die attachment using a patterned photoresist layer, which includes forming a photoresist layer on a LED chip and filling with solder paste, may control the location or quantity of solder paste by the pattern or the thickness of the patterned photoresist layer. The method includes forming a patterned photoresist layer on an epitaxial layer of a LED chip, filling the patterned photoresist layer with solder paste, and removing the patterned photoresist layer, wherein the patterned photoresist layer is aligned with a plurality of scribe lanes on the epitaxial layer of the LED chip.