Manufacturing method for a flip chip package
The manufacturing method for a flip chip package uses dipping method to cohere liquid-state stannum onto a plurality of gold bumps of a chip. The gold bumps are correspondingly connected to a plurality of first pads of a substrate so as to connect the chip and the substrate. Finally, a protecting ge...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The manufacturing method for a flip chip package uses dipping method to cohere liquid-state stannum onto a plurality of gold bumps of a chip. The gold bumps are correspondingly connected to a plurality of first pads of a substrate so as to connect the chip and the substrate. Finally, a protecting gel layer is disposed between the substrate and the chip, and covers the gold bumps. By utilizing the manufacturing method of the invention, the production cost could be reduced, and the manufacturing method of the invention could apply to process in which the bump pitch is less than 60 micron. In addition, by utilizing the manufacturing method of the invention, the gold bumps are strongly jointed with the first pads. Moreover, the manufacturing method of the invention could apply to various processes so that the application is much expansive. |
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