Flexible, low dielectric loss composition and manufacture method thereof

A flexible, low dielectric loss composition. The composition of the invention comprises (a) SrTiO3 and/or Ba (Sr) TiO3 ceramic particle or flexile macromoleules with functional groups, which is present in an amount about 20-80% by weight of the flexible substrate material; (b) at least one flexile m...

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Bibliographische Detailangaben
Hauptverfasser:	YU, MANUN, LIU, SHUR-FEN, CHEN, MENG-HUA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRICITY INSULATORS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A flexible, low dielectric loss composition. The composition of the invention comprises (a) SrTiO3 and/or Ba (Sr) TiO3 ceramic particle or flexile macromoleules with functional groups, which is present in an amount about 20-80% by weight of the flexible substrate material; (b) at least one flexile macromolecules, which are present in an amount about 1. 0-50% by weight of the flexible substrate material; and (c) a thermosetting organic resin. The flexible substrate material of the invention has the properties of high dielectric constant, low dielectric loss, and high flexibility, and it can be applied to PCB, RCC, or capacitors.