Process and apparatus for embossing a film surface

A process is provided for continuously embossing a pattern onto a surface of a flowable melt and then cooling the flowable melt to provide an embossed film. In one embodiment, the process includes heating a resin material to form a flowable melt; discharging the melt into a first nip, an area between an embossing roll and a backside roll; pressing the melt against the embossing roll and the backside roll; and forming a self-supporting film with a surface having an embossed pattern thereon. In one embodiment, the embossing roll is maintained at a temperature greater than the glass transition temperature of the resin material whereas the backside roll is maintained at a temperature less than the glass transition temperature of the resin. In one embodiment, the invention provides an embossed film frangibly fused to a carrier film. In another embodiment, the invention provides an embossed film affixed to a backing film.