CMOS process compatible MEMS probe card

A probe card includes a CMOS chip and a print circuit board. The said CMOS chip based on the standard CMOS-MEMS process is characterized by integrating a probe head with a space transformer. Because of having characteristic of fine pitch and high density, it could be served as a cantilever or a vertical probe card. The standard CMOS process provides multi-layer interconnections, which could assist the probe head in connecting with the external devices, giving the convenience in wiring layout. Furthermore, some passive components or signal-conditioning circuits are easily to be integrated into said CMOS chip to increase the frequency bandwidth and ensure better measuring quality. An array of bumps protruded as testing probes in said CMOS chip are fabricated with an electroforming process, and followed by a polishing process to improve their coplanarity. By several standard MEMS etching processes, the probes can be released and the back via-hole of said CMOS chip can be formed and filled with certain conductive