Lead inspection method and system of flexible printed circuit board and glass substrate outer lead bonding

The present invention relates to a lead inspection method and system of flexible printed circuit board (FPC) and glass substrate outer lead bonding (OLB). An optical image capturer with sensing elements such as silicon photodiodes is employed to capture and inspect the electric coupling status of the leads of the flexible printed circuit board and the glass substrate for each area, so as to at least obtain the coupling status of the X-axis and Y-axis. An image processing unit with a CPU is employed to connect with a driving module for at least forming correction of position formed by deviation of X-axis and Y-axis (and Z-axis) with respect to the position of the image captured. The lead correspondence of the flexible printed circuit board and the glass substrate is employed to partition a plurality of unit contacts for capturing and inspecting each area one by one, thereby saving the computation load of the CPU and achieving a more precise effect by partition and comparison.