A stacked package structure for reducing package volume of an acoustic microsensor

A stacked package structure for reducing package volume of an acoustic microsensor, the package structure mainly utilizes flip-chip technology to make the acoustic microsensor be stacked on an integrated circuit element. By designing a recession on the integrated circuit element as a back chamber of...

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Bibliographische Detailangaben
Hauptverfasser:	CHIEN, HSIN-TANG, HSIAO, CHIEH-LING, WANG, CHIN-HUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS PUBLIC ADDRESS SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A stacked package structure for reducing package volume of an acoustic microsensor, the package structure mainly utilizes flip-chip technology to make the acoustic microsensor be stacked on an integrated circuit element. By designing a recession on the integrated circuit element as a back chamber of the acoustic microsensor and using a glass with an opening or a planar substrate as a lid, the package volume of the acoustic microsensor can be reduced effectively.