Covered copper plate

This invention relates to a covered copper plate comprising a polyimide film, a copper plate placing on one side of the film via adhesive, and a copper plate placing on the other side of the film without adhesive; wherein the polyimide film comprises diamines consisted of p-phenylene diamine and 4,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OGUNI, MASAHIRO, SAWASAKI, KOICHI, MAEDA, MEGURU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	This invention relates to a covered copper plate comprising a polyimide film, a copper plate placing on one side of the film via adhesive, and a copper plate placing on the other side of the film without adhesive; wherein the polyimide film comprises diamines consisted of p-phenylene diamine and 4, 4'-diaminephenyl ether and acid dianhydrides consisted of pyromellitic acid and 3,3', 4,4'-biphenyltetracarboxylate dianhydride. Further, adding inorganic microparticles to the polyimide film make protuberances on surface and render slippery property.