Method of fibricating a circuit board
A method for fabricating a circuit board is provided. The process of fabricating a build-up insulating film includes: first, a first dielectric film is formed. After that, a second dielectric film is formed on the first dielectric film. By doing this, the uneven of the build-up insulating film can b...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | LIAO, HENG-WAY LIN, HSIENIEH YEH, CHANG-HSING CHIANG, KUOUN |
| description | A method for fabricating a circuit board is provided. The process of fabricating a build-up insulating film includes: first, a first dielectric film is formed. After that, a second dielectric film is formed on the first dielectric film. By doing this, the uneven of the build-up insulating film can be improved. In addition, by using the same material to fabricate the first dielectric film and second dielectric film, the surface roughening and via formation process can be performed more accurately. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW200908830A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW200908830A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW200908830A3</originalsourceid><addsrcrecordid>eNrjZFD1TS3JyE9RyE9TSMtMKspMTizJzEtXSFRIzixKLs0sUUjKTyxK4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgYGlgYWFsYGjsbEqAEAGKIm8A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of fibricating a circuit board</title><source>esp@cenet</source><creator>LIAO, HENG-WAY ; LIN, HSIENIEH ; YEH, CHANG-HSING ; CHIANG, KUOUN</creator><creatorcontrib>LIAO, HENG-WAY ; LIN, HSIENIEH ; YEH, CHANG-HSING ; CHIANG, KUOUN</creatorcontrib><description>A method for fabricating a circuit board is provided. The process of fabricating a build-up insulating film includes: first, a first dielectric film is formed. After that, a second dielectric film is formed on the first dielectric film. By doing this, the uneven of the build-up insulating film can be improved. In addition, by using the same material to fabricate the first dielectric film and second dielectric film, the surface roughening and via formation process can be performed more accurately.</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090216&DB=EPODOC&CC=TW&NR=200908830A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090216&DB=EPODOC&CC=TW&NR=200908830A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIAO, HENG-WAY</creatorcontrib><creatorcontrib>LIN, HSIENIEH</creatorcontrib><creatorcontrib>YEH, CHANG-HSING</creatorcontrib><creatorcontrib>CHIANG, KUOUN</creatorcontrib><title>Method of fibricating a circuit board</title><description>A method for fabricating a circuit board is provided. The process of fabricating a build-up insulating film includes: first, a first dielectric film is formed. After that, a second dielectric film is formed on the first dielectric film. By doing this, the uneven of the build-up insulating film can be improved. In addition, by using the same material to fabricate the first dielectric film and second dielectric film, the surface roughening and via formation process can be performed more accurately.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD1TS3JyE9RyE9TSMtMKspMTizJzEtXSFRIzixKLs0sUUjKTyxK4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgYGlgYWFsYGjsbEqAEAGKIm8A</recordid><startdate>20090216</startdate><enddate>20090216</enddate><creator>LIAO, HENG-WAY</creator><creator>LIN, HSIENIEH</creator><creator>YEH, CHANG-HSING</creator><creator>CHIANG, KUOUN</creator><scope>EVB</scope></search><sort><creationdate>20090216</creationdate><title>Method of fibricating a circuit board</title><author>LIAO, HENG-WAY ; LIN, HSIENIEH ; YEH, CHANG-HSING ; CHIANG, KUOUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW200908830A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2009</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIAO, HENG-WAY</creatorcontrib><creatorcontrib>LIN, HSIENIEH</creatorcontrib><creatorcontrib>YEH, CHANG-HSING</creatorcontrib><creatorcontrib>CHIANG, KUOUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIAO, HENG-WAY</au><au>LIN, HSIENIEH</au><au>YEH, CHANG-HSING</au><au>CHIANG, KUOUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of fibricating a circuit board</title><date>2009-02-16</date><risdate>2009</risdate><abstract>A method for fabricating a circuit board is provided. The process of fabricating a build-up insulating film includes: first, a first dielectric film is formed. After that, a second dielectric film is formed on the first dielectric film. By doing this, the uneven of the build-up insulating film can be improved. In addition, by using the same material to fabricate the first dielectric film and second dielectric film, the surface roughening and via formation process can be performed more accurately.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_TW200908830A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Method of fibricating a circuit board |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T07%3A26%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIAO,%20HENG-WAY&rft.date=2009-02-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW200908830A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |