Method of fibricating a circuit board
A method for fabricating a circuit board is provided. The process of fabricating a build-up insulating film includes: first, a first dielectric film is formed. After that, a second dielectric film is formed on the first dielectric film. By doing this, the uneven of the build-up insulating film can b...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A method for fabricating a circuit board is provided. The process of fabricating a build-up insulating film includes: first, a first dielectric film is formed. After that, a second dielectric film is formed on the first dielectric film. By doing this, the uneven of the build-up insulating film can be improved. In addition, by using the same material to fabricate the first dielectric film and second dielectric film, the surface roughening and via formation process can be performed more accurately. |
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