Method and system for removing tape from substrates

A method for removing tape (12) from a substrate (14) includes the step of detecting an actual distance between a peel head (20) and the tape (12) on the substrate (14), and a location of an edge (42) of the substrate (14). The method also includes the steps of moving the peel head (20) in a first d...

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Bibliographische Detailangaben
Hauptverfasser:	TAN, KIAN SHING MICHAEL, NEO, CHEE PENG, TAN, CHEE YONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES PACKING PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STORING TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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