Method and system for removing tape from substrates
A method for removing tape (12) from a substrate (14) includes the step of detecting an actual distance between a peel head (20) and the tape (12) on the substrate (14), and a location of an edge (42) of the substrate (14). The method also includes the steps of moving the peel head (20) in a first d...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A method for removing tape (12) from a substrate (14) includes the step of detecting an actual distance between a peel head (20) and the tape (12) on the substrate (14), and a location of an edge (42) of the substrate (14). The method also includes the steps of moving the peel head (20) in a first direction by an amount equal to the distance to press the peel tape (26) onto the tape (12) on the substrate (14), moving the peel head (20) in a second direction to the edge (42) of the substrate (14), and then moving the peel head (20) in an opposite second direction to peel the tape (12) from the substrate (14). The detecting step can be performed using a sensor such as a capacitance probe sensor (50), (52) or an optical sensor (62), (64). Alternately, rather than detecting the distance, a pressure sensing system (68) can be used to press the peel head (20) against the tape (12), and to maintain a predetermined pressure range during the peeling process. A system (48), (56), (60) for performing the method includes |
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