Method for grinding semiconductor wafers

The present invention relates to a method for grinding semiconductor wafers, the semiconductor wagers being processed so as to remove material on one or both sides by means of at least one grinding tool, respectively with supply of a coolant into a contact region between the semiconductor wafer and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WEIB, ROBERT, JUNGE, JOACHIM
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a method for grinding semiconductor wafers, the semiconductor wagers being processed so as to remove material on one or both sides by means of at least one grinding tool, respectively with supply of a coolant into a contact region between the semiconductor wafer and the at least one grinding tool, characterized in that the coolant flow rate is respectively selected as a function of a grinding tooth height of the at least one grinding tool and this coolant flow rate is reduced as the grinding tooth height decreases.