Device socket, mother board and test device

A device socket, a mother board and a test device are provided for reducing the number of parts that should be exchanged. The device socket includes an upper conduction portion, wherein the upper conduction portion has conduction routes obtained by pressing a surface to form an elastic deformation, and the conduction routes electrically connect the surface to a rear surface; a lower conduction portion, wherein the lower conduction portion has conduction routes and an exposed surface, and the conduction routes electrically connect the surface to a rear surface; and a wiring substrate portion, wherein the wiring substrate portion is sandwiched between the rear surface of the upper conduction portion and the rear surface of the lower conduction portion, and performs and electrical wiring for the conduction portion and the rear surface of the lower conduction portion, and performs an electrical wiring for the conduction routes of the upper conduction portion and the conduction routes of the lower conduction porti