Camera module and method for making the same and image sensor package structure

The present invention relates to a camera module. The camera module includes a barrel, a holder and an image sensor. The barrel is received in one end of the holder. The image sensor includes a transparent element, a chip and a circuit board. The chip is structurally and electrically connected with...

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Bibliographische Detailangaben
Hauptverfasser:	LEI, ANANG, LO, SHIH-MIN, WANG, JENAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention relates to a camera module. The camera module includes a barrel, a holder and an image sensor. The barrel is received in one end of the holder. The image sensor includes a transparent element, a chip and a circuit board. The chip is structurally and electrically connected with the circuit board. At least three pellets of glue are disposed around sensing area of the chip. The transparent element is sticked to the chip by the pellets of glue. The other end of the holder which is opposite to the barrel is sticked to the sensor. The present invention also relates to a method for making the camera module and a image sensor package structure.