Circuit board and apparatus employing the same

Circuit board and apparatus employing the same

A circuit board is provided. The circuit board comprises a substrate, a plurality of connection pads, and an isolating layer. The connection pads are disposed on the substrate. The isolating layer having a wave structure is also on the substrate. The wave structure has at least a concave to fit in t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEE, PINI, NG, YEOW-LEONG, LIN, CHIN-YANG, CHANG, JIAN-SHING
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator LEE, PINI
NG, YEOW-LEONG
LIN, CHIN-YANG
CHANG, JIAN-SHING
description A circuit board is provided. The circuit board comprises a substrate, a plurality of connection pads, and an isolating layer. The connection pads are disposed on the substrate. The isolating layer having a wave structure is also on the substrate. The wave structure has at least a concave to fit in the direction perpendicular to the substrate.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW200847873A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW200847873A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW200847873A3</originalsourceid><addsrcrecordid>eNrjZNBzzixKLs0sUUjKTyxKUUjMA-KCgsSixJLSYoXU3IKc_MrMvHSFkoxUheLE3FQeBta0xJziVF4ozc2g6OYa4uyhm1qQH59aXJCYnJqXWhIfEm5kYGBhYm5hbuxoTIwaAPUYKrE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Circuit board and apparatus employing the same</title><source>esp@cenet</source><creator>LEE, PINI ; NG, YEOW-LEONG ; LIN, CHIN-YANG ; CHANG, JIAN-SHING</creator><creatorcontrib>LEE, PINI ; NG, YEOW-LEONG ; LIN, CHIN-YANG ; CHANG, JIAN-SHING</creatorcontrib><description>A circuit board is provided. The circuit board comprises a substrate, a plurality of connection pads, and an isolating layer. The connection pads are disposed on the substrate. The isolating layer having a wave structure is also on the substrate. The wave structure has at least a concave to fit in the direction perpendicular to the substrate.</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20081201&amp;DB=EPODOC&amp;CC=TW&amp;NR=200847873A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20081201&amp;DB=EPODOC&amp;CC=TW&amp;NR=200847873A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE, PINI</creatorcontrib><creatorcontrib>NG, YEOW-LEONG</creatorcontrib><creatorcontrib>LIN, CHIN-YANG</creatorcontrib><creatorcontrib>CHANG, JIAN-SHING</creatorcontrib><title>Circuit board and apparatus employing the same</title><description>A circuit board is provided. The circuit board comprises a substrate, a plurality of connection pads, and an isolating layer. The connection pads are disposed on the substrate. The isolating layer having a wave structure is also on the substrate. The wave structure has at least a concave to fit in the direction perpendicular to the substrate.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBzzixKLs0sUUjKTyxKUUjMA-KCgsSixJLSYoXU3IKc_MrMvHSFkoxUheLE3FQeBta0xJziVF4ozc2g6OYa4uyhm1qQH59aXJCYnJqXWhIfEm5kYGBhYm5hbuxoTIwaAPUYKrE</recordid><startdate>20081201</startdate><enddate>20081201</enddate><creator>LEE, PINI</creator><creator>NG, YEOW-LEONG</creator><creator>LIN, CHIN-YANG</creator><creator>CHANG, JIAN-SHING</creator><scope>EVB</scope></search><sort><creationdate>20081201</creationdate><title>Circuit board and apparatus employing the same</title><author>LEE, PINI ; NG, YEOW-LEONG ; LIN, CHIN-YANG ; CHANG, JIAN-SHING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW200847873A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2008</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, PINI</creatorcontrib><creatorcontrib>NG, YEOW-LEONG</creatorcontrib><creatorcontrib>LIN, CHIN-YANG</creatorcontrib><creatorcontrib>CHANG, JIAN-SHING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, PINI</au><au>NG, YEOW-LEONG</au><au>LIN, CHIN-YANG</au><au>CHANG, JIAN-SHING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Circuit board and apparatus employing the same</title><date>2008-12-01</date><risdate>2008</risdate><abstract>A circuit board is provided. The circuit board comprises a substrate, a plurality of connection pads, and an isolating layer. The connection pads are disposed on the substrate. The isolating layer having a wave structure is also on the substrate. The wave structure has at least a concave to fit in the direction perpendicular to the substrate.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW200847873A
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Circuit board and apparatus employing the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T13%3A25%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LEE,%20PINI&rft.date=2008-12-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW200847873A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true