Circuit board and apparatus employing the same

A circuit board is provided. The circuit board comprises a substrate, a plurality of connection pads, and an isolating layer. The connection pads are disposed on the substrate. The isolating layer having a wave structure is also on the substrate. The wave structure has at least a concave to fit in t...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, PINI, NG, YEOW-LEONG, LIN, CHIN-YANG, CHANG, JIAN-SHING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A circuit board is provided. The circuit board comprises a substrate, a plurality of connection pads, and an isolating layer. The connection pads are disposed on the substrate. The isolating layer having a wave structure is also on the substrate. The wave structure has at least a concave to fit in the direction perpendicular to the substrate.