Flip-chip semiconductor package structure and package substrate applicable thereto

A flip-chip semiconductor package structure and a substrate structure applicable thereto are disclosed. The package substrate includes a body having at least one chip-attach area formed thereon, a plurality of solder pads disposed in the chip-attach area and being aligned in a manner to have different intervals therebetween; and a current-disturbing portion disposed in the chip-attach area at a loosely aligned position for allowing the flip-chip semiconductor chip to be mounted on the solder pad via the conductive bump, wherein an encapsulant material is filled in the interval between the package substrate and the flip-chip semiconductor chip in the bottom portion of the flip-chip semiconductor package structure to encapsulate the conductive bump and the current-disturbing portion therein. The disposal of the conductive bump at a loosely aligned position allows the current-disturbing portion to be disposed in a protrusive manner, thereby reducing the interval between the package substrate and the flip-chip se