Method and device for producing a rigid-flexible printed circuit board and rigid-flexible printed circuit board

In a method for producing a rigid-flexible circuit board, at least one rigid region (1, 12, 13) of a printed circuit board is connected with at least one flexible region (10) of a printed circuit board through a layer composed of a non-conductive material or a dielectric layer. In a region of a subsequently divided portion (11) of the rigid region of the printed circuit board, a region (8) between the rigid and flexible regions of the printed circuit board is set for a layer ready to be installed and composed of nonconductive materials or dielectric by applying a material preventing a layer (9) to be installed from being bonded to the rigid region subsequently, thus discharging the direct connection of the region between the rigid region (1, 12, 13) and the flexible region (10) of the printed circuit board. The present invention further discloses a rigid-flexible printed circuit board, wherein with a simple method step and thinner layer thickness, an elevated registering accuracy and a more simplified process