Semiconductor device incorporating an electronic component and fabrication method thereof

A semiconductor device incorporating an electronic component and a fabrication method thereof are disclosed. The method includes providing a substrate having at least a pair of solder pads disposed on the surface thereof for forming conductive material on and partially covering the solder pads via a screen printing technique, and further forming a corresponding recess portion on the conductive material for allowing an electronic component to be mounted onto the pair of solder pads and also the two terminals to be accommodated into the recess portion of the conductive material, thereby enabling the electronic component to be electrically connecting to the pair of solder pads via a reflow process. The formation of the recess portion on the conductive material effectively secures the mounting of the electronic component in position. Also, the cause of a warp problem due to uneven coating volume applied to the two ends of the electronic component can be prevented as the component does not have the conductive mate