Polyimide film and process for producing the same

A polyimide film characterized in that is made by imidization mainly of paraphenylene diamine and 4,4' -diaminodiphenyl ether as diamine components and pyromellitic acid as acid anhydride, and an inorganic particle having a particle diameter in the range of 0.01 to 1.5 m, an average particle di...

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Bibliographische Detailangaben
Hauptverfasser:	SAWASAKI, KOICHI, TESHIBA, TOSHIHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	A polyimide film characterized in that is made by imidization mainly of paraphenylene diamine and 4,4' -diaminodiphenyl ether as diamine components and pyromellitic acid as acid anhydride, and an inorganic particle having a particle diameter in the range of 0.01 to 1.5 m, an average particle diameter of 0.05 to 0.7 m and a particle size distribution that the proportion of the particles having a particle diameter of 0.15 to 0.60 m to the total particles being 80% by volume or more is dispersed into the film in a proportion of 0.1 to 0.9% by weight per film resin weight.