Method and device for wetting the bumps of a semiconductor chip with soldering flux

The present invention relates to a method and a device for wetting the bumps of a semiconductor chip with a soldering flux, in which a container (4), which accommodates the soldering flux and is open on the bottom, and a base plate (2), which contains at least one cavity (3), are moved back-and-fort...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WERNE, DOMINIK, BAUMANN, DAMIAN, GRUETER, RUEDI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present invention relates to a method and a device for wetting the bumps of a semiconductor chip with a soldering flux, in which a container (4), which accommodates the soldering flux and is open on the bottom, and a base plate (2), which contains at least one cavity (3), are moved back-and-forth in relation to one another on one side of the cavity (3) to the other side of the cavity (3). The viewed in the movement direction front wall (5 or 6) of the container (4) is lifted up during the relative movement, so that it is located at a distance above the base plate (2). The distance is somewhat greater than the height difference by which the soldering flux projects above the level of the surface of the base plate (2). This measure has the effect that the front wall (5 or 6) of the container (4) does not convey any soldering flux (3) onto the base plate (2), which has caused the loss of this soldering flux until now.