A light emitting device and the manufacture method thereof
This invention provides a light-emitting device and the manufacture method thereof. The light-emitting device is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for directly bonding to a submount. A bonding within a relatively short distance between the li...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | This invention provides a light-emitting device and the manufacture method thereof. The light-emitting device is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for directly bonding to a submount. A bonding within a relatively short distance between the light-emitting device and the submount can be formed so as to improve the heat dissipation efficiency of the light-emitting device. |
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