Laser treatment method

The present invention relates to a laser treatment method for cutting a brittle substrate. The method includes the steps of: forming a pre-cutting mark on the brittle substrate with a crazing device; heating the brittle substrate along the pre-cutting mark with a laser beam; cooling the heated britt...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HSU, TSUNG-FU, FU, CHEN-TSU, KUO, FANG SHIUAN, CHEN, HSIEN-TANG, HUANG, CHUN-KAI, CHANG, MING-HUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present invention relates to a laser treatment method for cutting a brittle substrate. The method includes the steps of: forming a pre-cutting mark on the brittle substrate with a crazing device; heating the brittle substrate along the pre-cutting mark with a laser beam; cooling the heated brittle substrate with a gas having a temperature below 0 DEG C, whereby the brittle substrate is splitted along the pre-cutting mark.