Method of concurrently patterning a substrate having a plurality of fields and a plurality of alignment marks

A method of patterning a substrate comprising first and second fields with a template, the template having a mold and a plurality of alignment forming areas and a plurality of template alignment marks, the method comprising: positioning a material on the first field of the substrate and a plurality...

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Bibliographische Detailangaben
Hauptverfasser: MELLIAR-SMITH, CHRISTOPHER MARK, SREENIVASAN, SIDLGATA V, MCMACKIN, IAN M, CHOI, BYUNG-JIN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A method of patterning a substrate comprising first and second fields with a template, the template having a mold and a plurality of alignment forming areas and a plurality of template alignment marks, the method comprising: positioning a material on the first field of the substrate and a plurality of regions of the substrate, the plurality of regions laying outside of the first and second fields; positioning The mold and the substrate such that a desired spatial relationship between the mold and the first field of the substrate is obtained to define a pattern in the material on the first field of the substrate while concurrently defining a plurality of substrate alignment marks with the material in the plurality of regions of the substrate in superimposition with the plurality of alignment forming areas of the template; positioning a material on the second field of the substrate; and positioning the mold and the substrate to obtain a desired spatial relationship between the plurality of template alignment ma