Flip chip packaging process, flip chip package structure and carrier thereof

A flip chip package structure including a carrier, a chip, multiple first bumps and multiple second bumps is provided. The carrier has a carrying surface and multiple contacts disposed thereon. The chip is disposed on the carrier, wherein and the chip has a bonding surface facing the carrier and multiple bumping pads disposed thereon. The first bumps are disposed between parts of the bumping pads and the corresponding contacts, while the second bumps are disposed between the other bumping pads and the corresponding contacts. The ductility of the second bumps is better than that of the first bumps. Furthermore, a flip chip packaging process for fabricating the flip chip package structure and a carrier constituting the flip chip package structure are provided. The flip chip package structure can improve the reliability against the nonuniform thermal stress issues.