Apparatus for aligning microchips on substrate and method for the same

An apparatus for Aligning the microchips on a substrate and a method for the same are provided. The steps of the method include providing a substrate, forming a protrusive configuration on the substrate, providing a microelement, forming a microdroplet on the protrusive configuration, and enabling t...

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Bibliographische Detailangaben
Hauptverfasser: YEH, ANDREW JE-LIANG, HUANG, YI-PING, HSIEH, MAX JR-HUNG, TSAI, GARY. JR-WEI, KAO, CHI CHUN, WENG, WEN-JEY, CHOU, MING HUNG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:An apparatus for Aligning the microchips on a substrate and a method for the same are provided. The steps of the method include providing a substrate, forming a protrusive configuration on the substrate, providing a microelement, forming a microdroplet on the protrusive configuration, and enabling the microelement to contact the mirodroplet. A surface tension of the microdroplet is used to move the microdroplet to a surface of the protrusive configuration.